課程大綱(Course Outline)
- To learn basic semiconductor (IC) processing and process integration
- Detailed principle of each unit processing, such as silicon wafer fabrication, Lithography, Oxidation and Si/SiO2 interface, Diffusion/annealing, Ion Implantation, Thin Film Deposition, Etching, CMP
- Understanding integrated processing, such as device Isolation, contacts and metallization including Al, Cu Interconnect, and CMOS processes
- 教師(teacher): 彭洞清