課程大綱(Course Outline)
  • To learn basic semiconductor (IC) processing and process integration
  • Detailed principle of each unit processing, such as  silicon wafer fabrication, Lithography, Oxidation and Si/SiO2 interface, Diffusion/annealing, Ion Implantation, Thin Film Deposition, Etching, CMP
  • Understanding integrated processing, such as device Isolation, contacts and metallization including Al, Cu Interconnect, and  CMOS processes
Class syllabus.pdfClass syllabus.pdf