封測學程(Program on Semiconductor Packaging and Testing)

(中文) 本課程提供學生智慧製造導入與實作相關知識。涵蓋的主題包括機器學習、深度學習和時間序列預測等相關理論以及編程語言。

(英文) This course provides students with knowledge about the introduction and implementation of intelligent manufacturing. Covered topics include theories of machine learning, deep learning, and time series prediction, as well as programming languages.